Ron Huemoeller Joins Saras Micro Devices as The New CEO

Ron Huemoeller, an industry leader, is named CEO of Saras Micro Devices.

FREMONT, CA: “It is a great pleasure to welcome Ron as the new CEO of Saras, to help define and bring SMDs vision to life,” says Rama Alapati, SMD Executive Chairman. The Board of Directors of Saras Micro Devices (SMD), a developer of sophisticated power delivery systems for high-performance semiconductor devices, has chosen Ron Huemoeller as CEO, beginning January 9, 2023.

“His wide breadth of experience, leadership capabilities, team building skills, and relationships with customers and semiconductor supply chain partners will help Saras build & deliver best-in-class power delivery solutions for high-performance computing applications,” adds Alapati.

Huemoeller will provide leadership, strategy, and technical direction to the skilled SMD team in Atlanta, Georgia; Chandler, Arizona; and Cupertino, California. In addition, he will serve on the Board of Directors of the company. With over 25 years of senior/executive management expertise in semiconductor packaging and technology, Huemoellers will be able to position Saras for both short- and long-term success.

“I am thrilled to be joining Saras Micro Devices at this critical inflection in the semiconductor industry as integrated packaging takes a more prominent role in system power performance and look forward to building a business that delivers sustainable, profitable growth,” comments Huemoeller. “I want to thank the Saras Board for trusting me to lead the company forward.”

Huemoeller most recently worked as Managing Director for the Packaging Business Unit at Applied Materials, following his tenure as President of Nano Circuit Technologies, providing business and technical innovation services to semiconductor firms worldwide. Before this, he was Corporate Vice President and Head of Global R&D and Technology Strategy at Amkor Technology. In this position, he defined the company's technology strategy and direction, bringing over 250 new products to market and earning over $2 billion in profitable revenue over five years.

Before joining Amkor, Huemoeller served as Director/Head Engineer of Printed Circuit Operations at Cray Computer Corporation, where he oversaw the launch and production ramp-up of a laminate substrate module operation powering the world's most powerful supercomputers. More than 200 U.S. patents have been granted to him, including essential inventions for semiconductor packaging technologies such as Fan Out, TMV, Flip Chip, Si-Bridge, TSV, and many substrate innovations. From 2016 to 2020, he served as President and Past President of the International Microelectronics Assembly and Packaging Society (IMAPS).

Huemoeller earned a Bachelor of Science in Chemistry with highest honors from Augsburg University and a Master of Science in Technology Management from the University of Phoenix.

“We’re excited to have Ron join us. We are looking forward to him, in collaboration with the senior leadership team, defining and executing on the Saras technology, manufacturing, and go-to-market roadmaps, enabling the company to scale and grow to its full potential over the next few years,” concludes  Alapati.